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Details of Grant 

EPSRC Reference: DT/E010873/1
Title: DURABLE HIGH TEMPERATURE ELECTRONICS PACKAGING FOR DOWN-WELL APPLICATIONS
Principal Investigator: Johnston, Dr C
Other Investigators:
Grant, Professor P
Researcher Co-Investigators:
Project Partners:
Department: Materials
Organisation: University of Oxford
Scheme: Technology Programme
Starts: 30 September 2007 Ends: 29 June 2011 Value (£): 110,340
EPSRC Research Topic Classifications:
Electronic Devices & Subsys. Oil & Gas Extraction
EPSRC Industrial Sector Classifications:
Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
This proposal addresses the issue of high temperature electronics packaging technology for down-well logging in the oil and gas industries, where there is a need to continously monitor the reservoir potential and environment to maximise recovery of reserves. Currently there are temperature and time restrictions on the exposure of electronics systems within the down-well logging application. This proposal aims to extend the high temperature electronics packaging capability to up to 250 oC for a lifetime of up to 10 years. This will be achieved through novel substrate and interconnection technologies that will optimise thermal management, mechanical robustness and are suited to high temperature environments. Advanced modelling/accelerated life tests and failure analysis will be used to yield accurate life predictions within the down-well logging environment. Spin-off benefits will also apply to the aerospace industry.
Key Findings
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Summary
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Project URL: http://www.materials.ox.ac.uk/peoplepages/johnston.html
Further Information:  
Organisation Website: http://www.ox.ac.uk