Details of Grant 

EPSRC Reference:	GR/L03095/01
Title:	MECHANICAL EVALUATIONOF LEAD-FREE SOLDERS FOR ELECTRONICS
Principal Investigator:	Plumbridge, Professor W
Other Investigators:	Hermann, Mr R
Researcher Co-Investigators:
Project Partners:	Itri Ltd Mitel Pre Nexus Migration
Department:	Materials Engineering
Organisation:	Open University
Scheme:	Standard Research (Pre-FEC)
Starts:	27 September 1996	Ends:	31 July 1998	Value (£):	19,893
EPSRC Research Topic Classifications:	Materials Characterisation
EPSRC Industrial Sector Classifications:	Aerospace, Defence and Marine Manufacturing
Related Grants:
Panel History:
Summary on Grant Application Form
The drive towards miniaturisation of electronic devices has imposed additional and increasing demands on soldered joints to provide structural integrity as well as electrical continuity. Most solders contain lead, a toxic metal under growing pressure, from the environment lobby, for its elimination. Before a new solder can be adopted by the industry, its reliability I service must be assured. The programme will evaluate the mechanical behaviour of candidate lead-free alloys (such as tin-copper, tin-silver) under conditions representative of service, i.e./ fatigue, creep and fatigue creep interactions. Complementary metallographic studies will identify the operative dominant failure mechanisms and provide insight into the role of microstructure. Information from both investigations will be used subsequently to explore the extend to which life prediction methods, developed for high temperature alloys such as steel and nickel based superalloys, may be applied to solders. The project will enable ranking of candidate lead-free alloys, provide information useful for further alloy development and, in conjunction with finite element analysis of specific joint geometries contribute to successful joint design. Companies first to incorporate lead-free connections will be at a distinct advantage. Simultaneously, the eradication of lead will constitute a significant environmental bonus.
Key Findings
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