| EPSRC Reference: |
GR/L17207/01 |
| Title: |
TREATMENT OF ELECTRONIC SCRAP |
| Principal Investigator: |
Fray, Professor D |
| Other Investigators: |
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| Researcher Co-Investigators: |
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| Project Partners: |
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| Department: |
Materials Science & Metallurgy |
| Organisation: |
University of Cambridge |
| Scheme: |
LINK |
| Starts: |
01 July 1997 |
Ends: |
30 September 1999 |
Value (£): |
108,543
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Summary on Grant Application Form |
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The quantity of electronic scrap will continue to grow in the foreseeable future and there is a need to be able to recycle used printed circuit boards, together with components. At the present time, various processes are such as melting in which the value of the electronic component is totally lost, removal of the components and landfilling of boards and lastly, dissolution of solder and copper and treatment of solutions to produce pure metals. The integrated approach adopted in this proposal will result in the components being separated and re-sold, the solder leached and redeposited as a solder alloy, the copper leached and deposited as copper. The shredded boards will be used as a binder in aggregate use.
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Key Findings |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Potential use in non-academic contexts |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Impacts |
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| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
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| Date Materialised |
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Sectors submitted by the Researcher |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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| Project URL: |
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| Further Information: |
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| Organisation Website: |
http://www.cam.ac.uk |