EPSRC Reference: |
GR/L74019/01 |
Title: |
ROPA: NON-THERMAL TECHNIQUES FOR THE REWORK AND REPAIR OF ELECTRONIC ASSEMBLIES |
Principal Investigator: |
Whalley, Mr D |
Other Investigators: |
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Researcher Co-Investigators: |
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Project Partners: |
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Department: |
Manufacturing Engineering |
Organisation: |
Loughborough University |
Scheme: |
ROPA |
Starts: |
01 October 1997 |
Ends: |
30 September 1998 |
Value (£): |
57,117
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EPSRC Research Topic Classifications: |
Design & Testing Technology |
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EPSRC Industrial Sector Classifications: |
No relevance to Underpinning Sectors |
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Related Grants: |
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Panel History: |
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Summary on Grant Application Form |
Soft soldering is (and is likely to remain) the primary joining technology in electronics assembly. Component removal is traditionally achieved by remelting of the solder, but the exposure of the assembly or its component parts to repeated soldering/desoldering cycles may cause both immediate damage and create a significant long term reliability hazard. This proposed project will explore the feasibility of using alternative, non-thermal, techniques to the process of component removal. Techniques to be evaluated will include chemical and mechanical approaches on conventional assemblies and the addition of a smart release layer between the solder and either substrate or component which will allow component removal by the application of, for example, a very specific chemical agent type of radiation or other means of physical degradation such as an allotropic transformation.
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Key Findings |
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Potential use in non-academic contexts |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Impacts |
Description |
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Summary |
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Date Materialised |
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Sectors submitted by the Researcher |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Project URL: |
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Further Information: |
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Organisation Website: |
http://www.lboro.ac.uk |