EPSRC Reference: |
GR/M01548/01 |
Title: |
GAAS MMIC FLIP CHIP PACKAGING FOR MILLIMETRE WAVE CONSUMER CIRCUITS |
Principal Investigator: |
Linton, Dr D |
Other Investigators: |
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Researcher Co-Investigators: |
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Project Partners: |
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Department: |
Sch of Electronics, Elec Eng & Comp Sci |
Organisation: |
Queen's University of Belfast |
Scheme: |
Standard Research (Pre-FEC) |
Starts: |
01 August 1998 |
Ends: |
30 April 2002 |
Value (£): |
337,764
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EPSRC Research Topic Classifications: |
Design & Testing Technology |
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EPSRC Industrial Sector Classifications: |
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Related Grants: |
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Panel History: |
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Summary on Grant Application Form |
Low cost, reliable flip chip technology applied to millimetre wave packaging of GaAs MMIC devies on softboard substrates will be researched in consultation with the flip chip development at Loughborough. Novel circuit models for the flip chip bump and coupling between the GaAs MMIC and the substrate will be examined using simulations validated using measurement at frequencies up to 85 GHz. Electromagnetic resonances and coupling between the inverted MMIC and the substrate will be characterised. The process of bumping GaAs MMICs will be developed offering high yield and low cost. Heat dissipation in a flip chip device at millimetre wave frequencies will be addressed using extra non electrical bumps as required to function as heat pipes. A demonstrator will be constructed to test the technology in a commercial application. The MMIC design expertise at QUB will be used to link the manufacturing process for chip interconnect and study the impact of process tolerance on functional performance.
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Key Findings |
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Potential use in non-academic contexts |
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Impacts |
Description |
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Summary |
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Date Materialised |
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Sectors submitted by the Researcher |
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Project URL: |
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Further Information: |
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Organisation Website: |
http://www.qub.ac.uk |