| EPSRC Reference: |
GR/M09292/01 |
| Title: |
MODELLING SOLDER JOINT FORMATION IN THE FLIP-CHIP PROCESS |
| Principal Investigator: |
Bailey, Professor C |
| Other Investigators: |
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| Department: |
Sch of Computing and Maths Sci |
| Organisation: |
University of Greenwich |
| Scheme: |
Standard Research (Pre-FEC) |
| Starts: |
01 April 1998 |
Ends: |
31 March 2000 |
Value (£): |
167,955
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Summary on Grant Application Form |
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This programme will develop details models representing the formation of solder joints from solder paste, consisting of solder pellets and a fluxing agent. Major effort will be spent on developing models for Solder-Flux reactions, voidage formation, and intermetallic formation. Using the multiphysics framework, PHYSICA, these models will be integrated into state-of-the-art integrated modelling technology for solidification and stress.The developed models will be validated using data from our collaborators. These models will then be used to help identify optimal process routes for flip-chip technology using current assembly techniques.
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Key Findings |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Potential use in non-academic contexts |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Impacts |
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| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
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| Date Materialised |
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Sectors submitted by the Researcher |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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| Project URL: |
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| Further Information: |
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| Organisation Website: |
http://www.gre.ac.uk |