| EPSRC Reference: |
GR/M44552/01 |
| Title: |
MECHANICAL PERFORMANCE AND LIFE PREDICTION OF LEAD-FREE SOLDER JOINTS FOR ELECTRONICS |
| Principal Investigator: |
Plumbridge, Professor W |
| Other Investigators: |
|
| Researcher Co-Investigators: |
|
| Project Partners: |
|
| Department: |
Materials Engineering |
| Organisation: |
Open University |
| Scheme: |
Standard Research (Pre-FEC) |
| Starts: |
31 August 1999 |
Ends: |
30 August 2002 |
Value (£): |
153,383
|
| EPSRC Research Topic Classifications: |
| Materials Characterisation |
|
|
| EPSRC Industrial Sector Classifications: |
| Aerospace, Defence and Marine |
Manufacturing |
| Communications |
Electronics |
|
| Related Grants: |
|
| Panel History: |
|
|
Summary on Grant Application Form |
|
Miniaturisation of electronic devices requires soldered joints to provide both structural integrity and electrical continuity. Most solders contain lead, a toxic metal under pressure from the environmental lobby for its elimination. Before a new solder can be adopted, its reliability in service must be assured. The programme will evaluate the behaviour of candidate lead-free alloys (such as tin-copper, tin-silver) in bulk and joint forms. Slow strain rate tensile, creep, fatigue-creep tests will be performed between -50 degrees centigrade and 130 degrees centigrade. Inert atmospheres will be used to isolate environment effects. Metallographic studies will identify dominant failure mechanisms and provide insight into the role of microstructure. The applicability of life prediction methods, developed for conventional high temperature alloys, will be explored. Recent modelling methods, using a fundamental approach, which claim to be capable of accommodating the time dependent behaviour of solder will be evaluated. The project will enable ranking of the solders, provide information useful for further alloy development and the correlation between bulk and joint properties. In conjunction with finite element analysis, the project will contribute to successful joint design by furnishing appropriate information regarding solder behaviour under conditions relevant to service.
|
|
Key Findings |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
|
Potential use in non-academic contexts |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
|
Impacts |
|
| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
|
| Date Materialised |
|
|
|
|
Sectors submitted by the Researcher |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
| Project URL: |
|
| Further Information: |
|
| Organisation Website: |
http://www.open.ac.uk |