Details of Grant 

EPSRC Reference:	GR/R45109/01
Title:	Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging
Principal Investigator:	Desmulliez, Professor M
Other Investigators:	Hyslop, Mr D
Researcher Co-Investigators:
Project Partners:
Department:	Sch of Engineering and Physical Science
Organisation:	Heriot-Watt University
Scheme:	Standard Research (Pre-FEC)
Starts:	01 October 2001	Ends:	30 September 2002	Value (£):	61,481
EPSRC Research Topic Classifications:	Manufact. Business Strategy
EPSRC Industrial Sector Classifications:	Aerospace, Defence and Marine Electronics
Related Grants:
Panel History:
Summary on Grant Application Form
Currently only a few CAD tools in electronics can cope with the complex hybrid structures used in device packaging. In the micro-mechanical domain, some tools can be found for simulating Micro-Electrical-Optical Modules (MOEMS) or Micro-Electro-Mechanical Systems (MEMS); for example MEMSEXPERT, MEMSCAP, INTELLISUITE and ANSYS MULTIPHYSICS. Mechanical and thermal simulations are largely carried out using standard commercial finite element modelling packages, such as I-DEAS and ABAQUS. In the electronic and opto-electronic domains a number of tools are available, based on a variety of simulation engines (SPICE, VHDL, HDLA, PTOLEMY, CODE-V, BEAMCAD, etc.). None of these packages incorporate the complex design interactions and linkages that are related to several domains. Future development of complex assemblies will require complete simulation tools, capable of modelling both the behaviour of each element and the interaction between electrical, mechanical, thermal and optical effects. The extent of development of more sophisticated design tools is unknown, as research is carried out in a number of discrete centres of excellence in Europe (Greenwich, Cork, Grenoble, Rome), North America (Pittsburgh, Berkeley, San Diego) and the Far East (Singapore). This proposal suggests that an international benchmarking study be carried out, comparing developments in the UK with the best design centres elsewhere in the world. The use of integrated design tools in the microelectronics industry and their potential impact on UK companies will also be considered.
Key Findings
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Organisation Website:	http://www.hw.ac.uk