| EP/P005705/1 | New Engineering Concepts from Phase Transitions: A Leidenfrost Engine | (C) |
| EP/N011341/1 | Flow Boiling and Condensation of Mixtures in Microscale | (C) |
| EP/K034510/1 | Implantable Microsystems for Personalised Anti-Cancer Therapy | (C) |
| EP/K00963X/1 | Boiling in microchannels: integrated design of closed-loop cooling system for devices operating at high heat fluxes | (C) |
| EP/J000779/1 | REFINE: A coordinated materials programme for the sustainable REduction of spent Fuel vital In a closed loop Nuclear Energy cycle | (C) |
| EP/F060076/1 | Hybrid organic semiconductor/gallium nitride/CMOS smart pixel arrays | (C) |
| EP/E018939/1 | Bridging the Gaps Between Engineering and Mathematics in the Edinburgh Research Partnership | (C) |
| EP/C532813/1 | BOILING HEAT TRANSFER WITH CONTROLLED ARRAYS OF NUCLEATION SITES ON SILICON SURFACES | (C) |
| EP/D500109/1 | Boiling and Condensation in Microchannels | (C) |
| EP/C546318/1 | ESPACENET: Evolvable Networks of Intell't & Secure Integrated & Dist'd Reconfigurable System-On-Chip Sensor Nodes for A'space Based Monitoring & Diag' | (C) |
| EP/C541820/1 | Equipment for Supporting Microsystems Research at Edinburgh & IMRC related projects at Cambridge, Cranfield, Heriot-Watt & Loughborough | (P) |
| EP/C51503X/1 | ReSIP - Reconfigurable System-on-Chip based Networks of Integrated and Distributed Sensor Platform Nodes for Environmental Diagnostic and Sensing | (C) |
| GR/T11531/01 | Optimisation of sub-100nm copper-interconnect & photoresist tracks for high-density IC fabrication metrology | (P) |
| GR/T06322/01 | Integration of Microelectromechanical Systems (MEMS) with Electronics in Silicon Carbide for Harsh Environments | (C) |
| GR/T07879/01 | NETWORK:Silicon Research and Exploitation For the Nanotechnology Era | (C) |
| GR/S12838/01 | PLATFORM: PLATFORM GRANT TO SUPPORT THE DEVELOPMENT OF MICRO/NANO TECHNOLOGY ACROSS A RANGE OF DISCIPLINES | (P) |
| GR/R65589/01 | Talking with Nerve Cells: Developing Communication Between Living Vertebrate Neurons and Electronic Systems | (C) |
| GR/R38019/01 | Development of Low Damage Dry Etch Processes for Silicon Carbide Microelectromechanical Systems (MEMS) | (C) |
| GR/M62280/01 | JIF:EQUIP.TO SUPPORT R&D INVOLV.THE MICROFABRICATION OF ADV.DEVICES & SYSTEMS BASED ON POST-PRO.FOUNDRY SIL | (P) |
| GR/M39305/01 | IMPROVING THE LINK BETWEEN DESIGN AND TEST FOR MINIATURE SILICON BACKPLANE LIQUID CRYSTAL DISPLAYS | (C) |
| GR/M41070/01 | ACME -- AL TO CU METALLISATION FOR IMPROVED RELIABILITY OF DEEP SUB - MICRON LINES AND VIAS | (P) |
| GR/M13534/01 | MANUFACTURING AND PACKAGING OF MINIATURE LIQUID CRYSTAL DISPLAY SYSTEM | (C) |
| GR/L63648/01 | CRITICAL AREA EXTRACTION FOR LEADING IC TECHNOLOGY | (P) |
| GR/L81000/01 | DEVELOPMENT OF TEST STRUCTURES FOR CHARACTERISING IC TECHNOLOGIES | (P) |
| GR/K89733/01 | INCORPORATION OF FACTORY SIMULATION INTO THE TOTAL TCAD FRAMEWORK | (P) |
| GR/L14664/01 | YIELD PREDICTION AND DFM OF IC LAYOUT | (P) |
| GR/J78471/01 | AN IMPROVED OPTIMISATION STRATEGY FOR SEMICONDUCTOR PROCESSES | (P) |
| GR/J78457/01 | FORMATION OF ALUMINIUM PLUGS USING A TEMPERATURE DEPENDENT STRESS RELIEVING MECHANISM | (C) |
| GR/J45824/01 | AUTOMATED THREE DIMENSIONAL INTERCONNECT SIMULATION FOR SUB-MICRON CIRCUIT DESIGN | (P) |
| GR/J59173/01 | DFM STRATEGIES FOR THE MANUFACTURE OF INTEGRATED CIRCUITS | (P) |
| GR/H40075/01 | PRACTICAL YIELD OPTIMISATION FOR LARGE AREA ICS USING YIELD PREDICTION AND LAYOUT ADJUSTMENT | (P) |
| GR/H32759/01 | TWO DIMENSIONAL ANALYSIS OF DOPANT AND IMPURITY DISTRIBUTIONS IN SEMICONDUCTORS USING SIMS | (C) |
| GR/H49856/01 | TWO DIMENSIONAL ANALYSIS OF DOPANT AND IMPURITY DISTRIBUTIONS IN SEMICONDUCTORS USING SIMS | (P) |
| GR/G28062/01 | DEVELOPMENT AND SUPPORT FOR THE EDINBURGHMICROFABRICA TION FACILITY | (C) |
| GR/F38884/01 | DEVELOPMENT OF INTEGRATED PROCESS AND DEVICE MODELLINGWITH APPLICATIONS TO SUB MICRON DEVICES | (P) |