EPSRC Reference: |
GR/J37003/01 |
Title: |
SELF - ASSEMBLING THREE-DIMENSIONAL MICROSTRUTURES |
Principal Investigator: |
Syms, Professor R |
Other Investigators: |
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Researcher Co-Investigators: |
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Project Partners: |
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Department: |
Electrical and Electronic Engineering |
Organisation: |
Imperial College London |
Scheme: |
Standard Research (Pre-FEC) |
Starts: |
01 March 1994 |
Ends: |
06 March 1996 |
Value (£): |
102,114
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EPSRC Research Topic Classifications: |
Materials Synthesis & Growth |
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EPSRC Industrial Sector Classifications: |
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Related Grants: |
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Panel History: |
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Summary on Grant Application Form |
We propose a technique for self assembly of 2-D surface structures, patterned by conventional lithography, into 3-D structures, using an extension of self-aligning solder bonding techniques. This involves rotation out-of-plane of hinged components by surface tension in melted solder pads. We have anlysed the technique in some detail, and conclude that it is feasible for a wide range of sizes and materials in the sub-mm region. This would complement existing processes, such as the scarificial layer technique and LIGA, and make a greatly increased range of structures and applications possible in microengineering. In the project, we will first fabricate basic proof-of-principles structures, in collaboration with rAL, who will provide CVD facilities for the initial sacrificial layer fabrication. These structures allow better modelling and analysis of the process, in particular the strength, precision and dynamic response, and their dependences on process parameters. We will then construct more complex structures, and basic demonstrators for specific applications.
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Key Findings |
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Potential use in non-academic contexts |
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Impacts |
Description |
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Summary |
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Date Materialised |
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Sectors submitted by the Researcher |
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Project URL: |
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Further Information: |
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Organisation Website: |
http://www.imperial.ac.uk |