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EPSRC Reference: GR/K95819/01
Title: PROCESSING OF NOVEL DIELECTRIC STRUCTURES FOR MICROWAVE & MILLIMETRE-WAVE INTEGRATED CIRCUITS
Principal Investigator: Robertson, Professor I
Other Investigators:
Rezazadeh, Professor AA
Researcher Co-Investigators:
Project Partners:
Bookham Technology Plc
Department: Electronic Engineering
Organisation: Kings College London
Scheme: Standard Research (Pre-FEC)
Starts: 01 November 1995 Ends: 31 January 1996 Value (£): 24,864
EPSRC Research Topic Classifications:
RF & Microwave Technology
EPSRC Industrial Sector Classifications:
Communications Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
An experimental process to fabricate novel multilayer monolithic microwave integrated circuit (MMIC) structures using polyamide insulating dielectric layers has been developed successfully.In developing the process we have carefully studied polyamide layer formation, curing and dry etching processes in an attempt to obtain high quality dielectric layers suitable for MMIC applications. By employing the new 3 metal process a wide range of passive components has been demonstrated successfully. Amongst these are multi-layer spiral inductors and transformers, quadrature couplers, thin-film microstrip lines, a ring resonator filter, mm-wave patch antennas and V shaped MMIC coplanar waveguide (CPW) transmission lines with low characteristic impedance. The application of multilayer techniques in fabricating V-shaped conductors to avoid the well known current crowding effects of the conductor edges has been studied extensively. The circuits and components have been characterised on-wafer up to 40 GHz and show good performances.
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