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Details of Grant 

EPSRC Reference: GR/R61161/01
Title: Liquid phase connections for high temperature electronics: Feasibility Study
Principal Investigator: Mannan, Professor S
Other Investigators:
Clode, Dr MP
Researcher Co-Investigators:
Project Partners:
Ricardo Group
Department: Mechanical Engineering
Organisation: Kings College London
Scheme: Standard Research (Pre-FEC)
Starts: 01 March 2002 Ends: 30 November 2002 Value (£): 59,642
EPSRC Research Topic Classifications:
Electronic Devices & Subsys.
EPSRC Industrial Sector Classifications:
Electronics R&D
Related Grants:
Panel History:  
Summary on Grant Application Form
The aim of the proposed research is to demonstrate the feasibility of a new type of electrical connection between a semiconductor chip and circuit board, which increases reliability in high temperature environments. The proposed assembly will comprise a flip chip electrically connected to the substrate via a low melting point solder alloy and mechanically connected to the substrate by an underfill material. As the temperature of the assembly increases towards its operating temperature, the solder connection melts, releasing the mechanical stresses that cause fatigue failure in conventional flip chip assemblies. The proposed technique, if shown to be successful, could potentially revolutionise packaging of electronics for use in high temperature environments. These applications could include electronics used in the automotive and areospace industries, as well as in the oil and gas drilling industry. Successful demonstration of the proposed iques will lead to a full INTELLECT proposal in due course, which will deal with the wider implications of high temperature electronics assembly. Fundamental problems that will be addressed in this feasibility study include the respone of the connections to vibration, retention of electrical contact throughout the temperature cycle, and the effects of intermetallic growth.
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